Design Optimization of CMOS- MEMS Staggered Vertical Comb Based Micro Scanners

dc.contributor.authorWenhao Chen
dc.contributor.authorMingzheng Duani
dc.contributor.authorHadi Tavakkoli
dc.contributor.authorHuahuang Luo
dc.contributor.authorBin Zhao
dc.contributor.authorWibool Piyawattanametha
dc.contributor.authorYi-Kuen Lee
dc.date.accessioned2026-05-08T19:21:42Z
dc.date.issued2022-10-30
dc.description.abstractFor the first time, we propose a novel CMOS-MEMS staggered vertical comb based micro scanner (SVC-MS) for ID static out-of-plane rotation using CanSemiconductor 0.18μm IP6M, TSMC CMOS foundry process. Based on compact model, the parametric analysis shows the torsion spring width and the actuator thickness are two critical parameters in term of design, and design optimization using dimensional analysis can be conducted for improving the rotation angle(Ooptical=19.26°) and figure of merit (FoM=O.6) by 400% and 150% compared with the first design. The optimized design shows miniaturization with a mirror size of 800μm and a higher FoM of 0.6 among previous designs. In addition, critical ratio of geometry for increasing the input-output response with a lower voltage is found, which can improve the actuator's performance.
dc.identifier.doi10.1109/sensors52175.2022.9967132
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/18182
dc.publisher2022 IEEE Sensors
dc.subjectAdvanced MEMS and NEMS Technologies
dc.subjectAdvanced Surface Polishing Techniques
dc.subjectAdvanced Fiber Optic Sensors
dc.titleDesign Optimization of CMOS- MEMS Staggered Vertical Comb Based Micro Scanners
dc.typeArticle

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