Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

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dc.contributor.authorMookam, Niwat
dc.contributor.authorKanlayasiri, Kannachai
dc.date.accessioned2026-08-06T10:03:58Z
dc.date.available2026-08-06T10:03:58Z
dc.date.issued2012-01-01
dc.description.abstractThe growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An η-Cu <inf>6</inf>Sn <inf>5</inf> intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a Cu <inf>3</inf>Sn intermetallic phase between the Cu <inf>6</inf>Sn <inf>5</inf> layer and the copper substrate. e{open}-Cu <inf>3</inf>Sn with an orthorhombic lattice structure was found together with hexagonal Cu <inf>3</inf>Sn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range. © 2012 The Chinese Society for Metals.
dc.identifier.citationJournal of Materials Science and Technology, 28(1), 53-59, 2012
dc.identifier.doi10.1016/S1005-0302(12)60023-1
dc.identifier.issn10050302
dc.identifier.other2-s2.0-84856391272
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/4110
dc.sourceJournal of Materials Science and Technology
dc.subjectActivation energy
dc.subjectIntermetallics
dc.subjectMicrostructures
dc.subjectSoldering
dc.titleEvolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging
dc.typeArticle

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