Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

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dc.contributor.authorNiwat Mookam
dc.contributor.authorKannachai Kanlayasiri
dc.date.accessioned2025-07-21T05:52:36Z
dc.date.issued2012-01-01
dc.identifier.doi10.1016/s1005-0302(12)60023-1
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/3283
dc.subjectOrthorhombic crystal system
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleEvolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging
dc.typeArticle

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