Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

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dc.contributor.authorKannachai KANLAYASIRI
dc.contributor.authorRachata KONGCHAYASUKAWAT
dc.date.accessioned2025-07-21T06:00:01Z
dc.date.issued2018-06-01
dc.identifier.doi10.1016/s1003-6326(18)64754-5
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/7497
dc.subjectLiquidus
dc.subjectSolidus
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleProperty alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition
dc.typeArticle

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