Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate

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dc.contributor.authorKannachai Kanlayasiri
dc.contributor.authorKamtorn Sukpimai
dc.date.accessioned2025-07-21T05:56:47Z
dc.date.issued2016-02-01
dc.identifier.doi10.1016/j.jallcom.2016.01.231
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/5674
dc.subjectMorphology
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleEffects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate
dc.typeArticle

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