Effect of Different Preparing Methods on the Microstructures and Dielectric Relaxation Behaviors of CaCu<sub>3</sub>Ti<sub>4</sub>O<sub>12</sub>Ceramics

dc.contributor.authorWorawut Makcharoen
dc.date.accessioned2025-07-21T05:53:35Z
dc.date.issued2013-01-01
dc.identifier.doi10.1080/00150193.2013.846704
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/3813
dc.subjectHigh-_ dielectric
dc.subjectDielectric loss
dc.subject.classificationDielectric properties of ceramics
dc.titleEffect of Different Preparing Methods on the Microstructures and Dielectric Relaxation Behaviors of CaCu<sub>3</sub>Ti<sub>4</sub>O<sub>12</sub>Ceramics
dc.typeArticle

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