Effect of soldering condition on formation of intermetallic phases developed between Sn�0.3Ag�0.7Cu low-silver lead-free solder and Cu substrate

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dc.contributor.authorNiwat Mookam
dc.contributor.authorKannachai Kanlayasiri
dc.date.accessioned2025-07-21T05:52:01Z
dc.date.issued2011-03-13
dc.identifier.doi10.1016/j.jallcom.2011.03.049
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/2917
dc.subjectDip soldering
dc.subjectOrthorhombic crystal system
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleEffect of soldering condition on formation of intermetallic phases developed between Sn�0.3Ag�0.7Cu low-silver lead-free solder and Cu substrate
dc.typeArticle

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