Figures of Merit of Low-Cost CuAl<sub>0.9</sub>Fe<sub>0.1</sub>O<sub>2</sub> Thermoelectric Material Prepared at Different Solid State Reaction Sintering Temperatures

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dc.contributor.authorAparporn Sakulkalavek
dc.contributor.authorRungnapa Thonglamul
dc.contributor.authorRachsak Sakdanuphab
dc.date.accessioned2025-07-21T05:56:06Z
dc.date.issued2015-08-01
dc.identifier.doi10.4028/www.scientific.net/kem.659.185
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/5283
dc.subjectFigure of Merit
dc.subject.classificationCopper-based nanomaterials and applications
dc.titleFigures of Merit of Low-Cost CuAl<sub>0.9</sub>Fe<sub>0.1</sub>O<sub>2</sub> Thermoelectric Material Prepared at Different Solid State Reaction Sintering Temperatures
dc.typeArticle

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