Effects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder

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dc.contributor.authorNiwat Mookam
dc.contributor.authorPrajak Jattakul
dc.contributor.authorKannachai Kanlayasiri
dc.date.accessioned2025-07-21T06:07:55Z
dc.date.issued2022-11-08
dc.identifier.doi10.4028/p-zcw87p
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/11786
dc.subjectLiquidus
dc.subjectSolidus
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleEffects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder
dc.typeArticle

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