Wetting state and mechanical property alteration for the Fe3Si films using rapid thermal annealing under various temperatures
| dc.contributor.author | Nattakorn Borwornpornmetee | |
| dc.contributor.author | Thawichai Traiprom | |
| dc.contributor.author | Takafumi Kusaba | |
| dc.contributor.author | Phongsaphak Sittimart | |
| dc.contributor.author | Hiroshi Naragino | |
| dc.contributor.author | Boonchoat Paosawatyanyong | |
| dc.contributor.author | Tsuyoshi Yoshitake | |
| dc.contributor.author | Nathaporn Promros | |
| dc.date.accessioned | 2026-05-08T19:20:51Z | |
| dc.date.issued | 2023-11-19 | |
| dc.description.abstract | Si films. | |
| dc.identifier.doi | 10.1016/j.heliyon.2023.e22511 | |
| dc.identifier.uri | https://dspace.kmitl.ac.th/handle/123456789/17732 | |
| dc.publisher | Heliyon | |
| dc.subject | Aluminum Alloys Composites Properties | |
| dc.subject | Semiconductor materials and interfaces | |
| dc.subject | Copper Interconnects and Reliability | |
| dc.title | Wetting state and mechanical property alteration for the Fe3Si films using rapid thermal annealing under various temperatures | |
| dc.type | Article |