Physical properties of Sn58Bi�xNi lead-free solder and its interfacial reaction with copper substrate

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dc.contributor.authorKannachai Kanlayasiri
dc.contributor.authorTadashi Ariga
dc.date.accessioned2025-07-21T05:56:04Z
dc.date.issued2015-07-26
dc.identifier.doi10.1016/j.matdes.2015.07.108
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/5256
dc.subjectElongation
dc.subjectVolume fraction
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titlePhysical properties of Sn58Bi�xNi lead-free solder and its interfacial reaction with copper substrate
dc.typeArticle

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