Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique

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dc.contributor.authorKavisra Jongjinakool
dc.contributor.authorTawipon Prakobsang
dc.contributor.authorSuwan Plaipichit
dc.contributor.authorKannachai Kanlayasiri
dc.contributor.authorMettaya Kitiwan
dc.contributor.authorPrathan Buranasiri
dc.date.accessioned2025-07-21T06:04:41Z
dc.date.issued2021-01-20
dc.identifier.doi10.1109/ica-symp50206.2021.9358245
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/10074
dc.subjectSolder paste
dc.subjectDigital holography
dc.subject.classificationDigital Holography and Microscopy
dc.titleInvestigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique
dc.typeArticle

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