A study on wettability and formation of intermetallic phase between CoCrMo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages - Tin Tin Kyaw; Phacharaphon Tunthawiroon; Kannachai Kanlayasiri; Kenta Yamanaka; Akihiko Chiba (My University, 2020)
Keywords: Electronic Packaging and Soldering Technologies