KMITL

Permanent URI for this communityhttps://dspace.kmitl.ac.th/handle/123456789/1

Browse

Settings

Author: search.filters.author.Jansaengsuk, ThodsaphonSubject: search.filters.subject.multiphysics

Search Results

Now showing 1 - 2 of 2
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Publication,
    Thermal simulation of microwave kiln based on multiphysics
    (2023-01-01)
    Jansaengsuk, Thodsaphon
    ;
    Pattanapichai, Sorathon
    ;
    Poopanya, Piyawong
    ;
    Phimphakan, Nonthawat
    ;
    Thongsri, Jatuporn
    A microwave kiln, made of silicon carbide and ceramic fiber, commonly employs in a household glassware production process. In this process, when the kiln was in a microwave oven, a microwave transmitted to the kiln generating a high temperature to fuse the glass inside. This article presents a thermal simulation to investigate the temperature inside the kiln based on multiphysics consisting of a high-frequency structure simulator (HFSS) and computational fluid dynamics (CFD). The multiphysics results revealed the temperature inside the kiln in a transient state, consistent with the experimental results. As expected, the temperature increased with the increasing time of the process. Significantly, the silicon carbide had higher temperatures than the ceramic fiber; therefore, silicon carbide is a crucial material for generating heat inside the kiln. In addition, the temperature-increasing rate (TIR) inside the kiln depended on the kiln's thickness (Th). As a result, the thinner Th provided better TIR. The research findings can be applied to develop a high-efficacy household glassware production process.
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Publication,
    A Development of Welding Tips for the Reflow Soldering Process Based on Multiphysics
    (2022-11-01)
    Thongsri, Jatuporn
    ;
    Jansaengsuk, Thodsaphon
    A reflow soldering process (RSP) is generally implemented in advanced manufacturing factories for welding small electronic components together to create a product using heat generated at the welding tip (WT). Improper WT design and operating conditions may lead to defects in some products; therefore, optimizing both is immensely significant in developing the RSP. Accordingly, this article proposes a successful RSP development based on multiphysics in a hard disk drive factory consisting of transient thermal-electric and structural simulations. First, a new shape series WT was designed, and a conventional shape, parallel WT, was considered as a case study. Then, they were assembled and experimented with the RSP actual operating conditions to collect essential data. Next, the heat transfer was determined using a transient thermal-electric simulation (TES). The simulation results showed uneven WT temperatures depending on applied voltages, time, and shapes, which were consistent with the experimental results. The higher the applied voltage, the greater the temperature generated at the WT. Finally, after using TES results as loads, the structural simulation showed WT total deformations, which could be consistent with actually occurring defects. The findings from this research are a new design of series WT and proper multiphysics methodology for developing the RSP.