KMITL

Permanent URI for this communityhttps://dspace.kmitl.ac.th/handle/123456789/1

Browse

Settings

Author: search.filters.author.Samakkarn, ChawitSubject: search.filters.subject.multiphysics

Search Results

Now showing 1 - 2 of 2
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Publication,
    Coupled Electromagnetic-Thermal Multiphysics Analysis and Design Optimization of a Microwave Kiln
    (2026-05-01)
    Samakkarn, Chawit
    ;
    Poopanya, Piyawong
    ;
    Thongsri, Jatuporn
    This study presents a multiphysics investigation of a microwave kiln for the glass-casting process, focusing on the coupled interaction between electromagnetic heating and thermal responses. The kiln (SiC-based) was experimentally tested in a household 800 W, 2450 MHz microwave oven without rotation for 5 min, with temperatures recorded at key positions using thermocouples and verified by thermal imaging. The computational framework integrates ANSYS (2021R1) High-Frequency Structure Simulator (HFSS) for electromagnetic-field and heat-generation prediction with Transient Thermal Analysis (TTA) for time-dependent temperature distribution. Validation showed agreement between simulation and experiment of the final temperature, with most errors below 4%, confirming the model’s reliability. A parametric study revealed that a thin SiC susceptor layer (1.5–2.0 mm) improves heat generation and temperature uniformity, while excessive thickness reduces heating efficiency. The optimized design improved the temperature by 2.58% compared with the original configuration at 800 W and achieved up to 38.44% improvement under specific operating conditions. These findings demonstrate that the proposed multiphysics method can support future development of small-scale glass-casting systems and sustainable recycled-glass production. Consequently, the work paves the way to Sustainable Development Goals (SDGs).
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Publication,
    Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components Due to the Reflow Soldering Process
    (2024-09-01)
    Kimaporn, Napatsorn
    ;
    Samakkarn, Chawit
    ;
    Thongsri, Jatuporn
    In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat generated by the welding tip to melt a solder ball for bonding the following essential HDD components: a flexible printed circuit (FPC) and a printed circuit cable (PCC). Since the mentioned components are tiny and comprise many thin material layers, an experiment to study thermal and mechanical responses is complex and not worth it. Therefore, a static state multiphysics consisting of thermal analysis (TA) and structural analysis (SA) was employed to investigate both responses. First, the experiment was established to mimic the RSP, measuring the temperature generated by the actual welding tip. Then, the measured temperature was defined as the boundary conditions with the pressing force (F) for the TA and SA based on the actual operating conditions. As expected, the TA results revealed the temperature distribution in the HDD components, which was consistent with the theory and results from previous work and confirmed this work’s credibility. Significantly, the SA reported severe total deformation (δ) in FPC’s top and bottom ends. The maximum δ was 0.72–0.88 mm for the F of 0–1 N. The stronger the F, the greater the δ. This research highlights that multiphysics can investigate both responses in HDD components as slight as 0.1–100 microns thick, which can be used to develop a high-efficacy RSP.