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    Harvesting energy from a rotating gear using an AFM-Like MEMS piezoelectric frequency up-converting energy harvester
    (2015-06-01)
    Janphuang, Pattanaphong
    ;
    Lockhart, Robert A.
    ;
    Isarakorn, Don
    ;
    Henein, Simon
    ;
    Briand, Danick
    This paper presents an analytical and experimental study of a compact configuration to harvest energy from a rotating gear using piezoelectric microelectromechanical system harvesters. The reported configuration realizes a contact-Type frequency up-conversion mechanism in order to generate useful electrical energy. The up-conversion mechanism was achieved using an atomic force microscope (AFM)-like piezoelectric cantilever plucked by the teeth of the rotating gear that could be eventually driven by an oscillating mass. This paper describes relevant design guidelines for harvesting energy from the low-frequency mechanical movement of a rotating gear through analytical modeling and finite element method (FEM) simulation followed by experimental validation. Different harvester configurations are investigated to identify the optimal configuration in terms of the output energy and energy conversion efficiency. The latter results are reported for the first time because of the implementation of an original concept based on the coupling of the harvester with a rotational flywheel. The experimental results reveal that free vibrations of the harvester after plucking contribute significantly to the output energy and efficiency. By adding a proof mass, the efficiency of the system can be greatly improved. For plucking speeds between 3 and 19 r/s, average output powers in the order of tens of microwatts were obtained for continuous plucking. By combining interaction energy, friction, and energy absorption, between the harvester and inertial mass, the maximum efficiency of the impact piezoelectric harvesters was found to be 1.4%. The efficiency results obtained were compared with the noncontact magnetic plucking approach further demonstrating the potential of our concept. Finally, different tip-gear materials combinations were evaluated showing the importance of their nature on the reliability of the presented configuration.
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    Electrostatic control and new device handling consideration for MEMS manufacturing process
    (2012-01-01)
    Chakkaew, Anusorn
    ;
    Titiroongruang, Wisut
    Electrostatic potential and electrostatic discharge (ESD) has been a factory issue for years, not only limited to semiconductor-based electronic devices, but there are evidences that new devices from emerging technologies become sensitive which are MEMS and NEMS. This paper describes new electrostatic control and device handling solutions for critical electrostatic control environment for MEMS manufacturing processes. There are experiments of personnel grounding devices, device handling materials, and evaluation of static control surfaces.
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    Electrostatic control and the need of feedback control ionization in critical environment of MEMS manufacturing process
    (2010-01-01)
    Chakkaew, Anusorn
    ;
    Titiroongruang, Wisut
    This paper describes new electrostatic control countermeasures and solutions for critical electrostatic control environment for MEMS manufacturing processes, especially in MEMS's wafer handling that needs low electrostatic voltage. This includes personnel grounding methodology, ESD event measurement, and low ion imbalance ionization to support current and future needs of the MEMS. © (2010) Trans Tech Publications.
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    Design consideration and finite element modeling of MEMS cantilever for nano-biosensor applications
    (2005-01-01)
    Klaitabtim, Don
    ;
    Tuantranont, Adisorn
    This work has focused on the design and finite element modeling of a MEMS cantilever beam for biosensor applications. The stress induced on gold surface with polysilicon piezoresistive sensing is demonstrated. In principle, adsorption of biochemical species on a functionalized surface of the microfabricated cantilever will cause a surface stress and consequently the cantilever bending. The sensing mechanism relies on the piezoresistive properties of the polysilicon wire encapsulated in the beam. The beam is constructed and bending analysis is performed so that the beam tip deflection could be predicted. The twelve independent beams were combined onto a single chip. The piezoresistor designs on the beams were varied, within certain constraints, so that the sensitivity of the sensing technique could be studied. The chip was laid out using Tanner L-edit and the design rules of the MUMPs process were followed. The device model was simulated using CoventorWare™, a commercial finite element analysis (FEA) tool designed specifically for MEMS applications. Finally, the MEMS cantilever beam was operated and caused increment in tip deflection due to biochemical adsorption on the gold surface. ©2005 IEEE.