Kanlayasiri, Kannachai

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Preferred name
Kanlayasiri, Kannachai
Alternative Name
KANLAYASIRI, Kannachai
Kanlayasiri, K.
Main Affiliation
Email
kannachai.ka@kmitl.ac.th

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    Item type:Publication,
    Effect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate
    (2011-05-26)
    Mookam, Niwat
    ;
    Kanlayasiri, Kannachai
    In this paper, effect of soldering time and temperature on formation of intermetallic compounds developed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate was investigated. Dip soldering was performed at 250, 270, and 290 °C with soldering time of 5, 10, 15, and 20 s. Either ε-Cu <inf>3</inf>Sn or η-Cu<inf>6</inf>Sn<inf>5</inf> intermetallic phase was found at the interface between the solder and the substrate depending on the soldering condition, i.e., soldering time and soldering temperature. ε-Cu<inf>3</inf>Sn was found only when the substrate was soldered at 250 °C for 5 and 10 s. At other soldering conditions, only η-Cu <inf>6</inf>Sn<inf>5</inf> was found at the interfacial zone. Crystal structure of ε-Cu<inf>3</inf>Sn intermetallic phase was orthorhombic, and it was hexagonal structure for η-Cu<inf>6</inf>Sn<inf>5</inf>. Transformation of the intermetallic phases was also discussed. © 2011 Elsevier B.V. All rights reserved.
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    Brazing of Porous Copper Foam with Copper Sheet Using CuNiSnP Amorphous Filler Metal
    (2021-01-01)
    Mookam, Niwat
    ;
    Jattakul, Prajak
    ;
    Rakphet, Tipsuda
    ;
    Kanlayasiri, Kannachai
    This research studies effects of the brazing time on interfacial microstructure of brazed joint between the porous copper foam (PCF) and Cu substrate using CuNiSnP amorphous filler metal. To examine the interfacial microstructure and its properties, an assessment of PCF/CuNiSnP/Cu brazed joints was conducted after electric furnace brazing under hydrogen (H2) atmosphere. The results showed that the interfacial microstructure was thick for short brazing time specimens and thin for prolonged brazing time specimens. The interfacial microstructures consisted of Cu-rich solid solution, (Cu, Ni)3P, and Cu3P as a eutectic structure discovered in the brazing region at different brazing times of 5, 10, and 20 min. Only the Cu-rich solid solution and (Cu, Ni)3P were found in the specimen with brazing time of 30 min. indicating that different brazing times affected interfacial microstructures and therefore reliability of the brazed joints.