Kanlayasiri, Kannachai

Preferred name

Alternative Name

KANLAYASIRI, Kannachai

Kanlayasiri, K.

Main Affiliation

School of Engineering

kannachai.ka@kmitl.ac.th

Now showing 1 - 10 of 18

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Influences of solid-state brazing conditions on microstructure and tensile shear force of Ag-Cu-P brazed copper sheets
(2018-06-04)
Jattakul, P.
;
Kanlayasiri, K.
This study aimed to examine the tensile shear force and microstructure of copper sheets when Ag-Cu-P filler metal was applied for the joints involved in the production of laminated micro-channel array (LMA) devices. The properties of the microstructure of the Ag- Cu-P/copper brazed joints were examined following a process which included furnace brazing, with the parameters comprising temperature, holding time, and loading pressure. Analytical tools included an energy dispersive spectrometer (EDS), scanning electron microscope (SEM) and X-ray diffraction analysis (XRD). In addition, tensile tests were performed to measure the tensile shear force. It was difficult to observe the Cu<inf>3</inf>P which forms along with the layer between the Ag-Cu-P filler metal and the copper sheet when the brazing temperature was only 580°C since this allowed gaps to form within the joint, thus producing very low tensile shear force results. When the brazing temperature is increased to 620°C along with longer holding time and increased pressure, this allows a thicker phase of Cu<inf>3</inf>P to form in the brazing joint. With a holding time of 30 minutes and pressure of 12.173 kPa, tensile shear force was maximized since this condition produced thick Cu<inf>3</inf>P phase. It is apparent that it is possible to produce a brazed joint which has an average shear force of 736.27 N under these conditions as described above. Within the joint could be found a Cu<inf>3</inf>P phase with no brittle phase.
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Effect of Si on Microstructure and Corrosion Behavior of CoCrMo Alloys
(2018-06-04)
Peaubuapuan, Chonlawit
;
Tunthawiroon, Phacharaphon
;
Kanlayasiri, Kannachai
;
Yuangyai, Chumpol
The aim of this research was to investigate the effect of silicon (Si) on the microstructure and corrosion behavior of CoCrMo alloys. The concentration of Si added in CoCrMo alloys was 0.1, 0.5 and 1 wt %. The corrosion behavior of the present alloys was investigated using potentiodynamic polarization measurements. The normal saline solution with 0.9 wt % was used as an electrolyte. Polarization curves obtained from the polarization test were used to evaluate in terms of corrosion current density (i<inf>corr</inf> ), corrosion potential (E<inf>corr</inf> ) and corrosion parameters that be used to compute corrosion resistant property of CoCrMo alloys. The microstructure of a sample during the polarization test was compared using X-ray diffraction (XRD) and optical microscope (OM). The results indicated that the increase in Si slightly changed the microstructure of CoCrMo alloys and could enhance the resistance to corrosion of CoCrMo alloys in NaCl solution. In addition, the reduction of Cr and Mo concentration in CoCrMo alloys was found to be a significant influence on the decrease in corrosion resistance.
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The Property Investigation of Solder Mixed with Thermoelectrics Alzno by Using Digital Holography
(2018-08-10)
Prakobsang, Tawipon
;
Plaipichit, Suwan
;
Kanlayasiri, Kannachai
;
Buranasiri, Prathan
In this paper in-line digital holography(DH) technique was used to investigate some properties of solder paste mixed with different percent weight of thermoelectric type AlZnO. By using reconstructed image results different properties of the compound solder pastes i.e. the contact angles, flux thickness were investigated. In addition, their electrical resistance also measured. From our reconstructed image results DH technique plus some computer programming would be one of efficient technique using in electronic industry in the future.
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Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate
(2018-08-14)
Mookam, Niwat
;
Kanlayasiri, Kannachai
In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated. Reflow soldering was performed at 350 ° C under variable soldering times of 10, 20, 40, 60, 120, 240 and 480 s. The results indicated that the wettability and intermetallic growth depend on the soldering time. In addition, the Cu<inf>6</inf>Sn<inf>5</inf> and Cu<inf>3</inf>Sn intermetallic phases with a hexagonal crystal structure were found between the lead-free solder and the copper substrate. The growth of intermetallic phases increased with soldering time, and the growth of intermetallic phases remarkably depended on grain boundary diffusion and was volume diffusion-controlled for Cu<inf>6</inf>Sn<inf>5</inf> and Cu<inf>3</inf>Sn, respectively.
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Contact Angle Measurement of Melting SnAgCu Solder Paste Mix with Carbon Allotropes Using In-Line Digital Holography Technique
(2021-01-01)
Mamart, Wikatsama
;
Somdock, Nuttakrit
;
Boonsri, Chantira
;
Plaipichit, Suwan
;
Buranasiri, Prathan
In this research we investigated the contact angle of commercial SnAgCu solder paste mixing with some carbon allotropes such as graphite, graphene quantum dots, and fullerene of varying concentrations with melting temperature, wettability, interfacial microstructure. The wettability was assessed in terms of the contact angle. The in-line digital holography was used for determining the contact angle and morphological of samples at each temperature which the samples have been heating from room temperature until the melting temperature. In the experiment, only one beam was used as the object and reference beams which recorded by a CMOS camera. The recorded image was reconstructed by the angular spectrum digital holography numerical programing. Using the reconstructed images of our results, the shape and contact angle of solder pastes can be investigated.
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Optimizing the resistance spot-welding process for dissimilar stainless steels
(2018-06-04)
Khuenkaew, T.
;
Kanlayasiri, K.
The objective of this study was to identify the ideal welding circumstances to conduct resistance spot-welding in the case of 316 austenite and 425 ferrite stainless steels, which offer the challenge of being dissimilar. The study examines a number of welding variables, including weld current, weld time, hold time, electrode force, and the upper and lower electrode types. Initially, a 2<sup>6-1</sup> fractional factorial design was used for the screening of variables involved in the process. After this stage, the Box-Behnken design was employed for analysis of those variables and in order to specify the multiple response optimizations applicable to the size of nuggets through examination of the desirability function. The experiment was run using a resistance spot-welding machine at 50 kVA, 50 Hz. The quality of welded specimens was determined by their penetration, nugget diameter and nugget area. The optimal welding conditions were found to be 3.3 kN of electrode force, 25 cycles of weld time, 10,000 amperes of weld current, 50 cycles of hold time, and both R30 types of up-low electrodes. The optimal welding conditions provided nugget sizes of quality which were able to pass the specifications of the customer.
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Effects of in addition on solidus and liquidus temperatures, microhardness, and wettability of Sn-0.3Ag-0.7Cu solder alloy
(2008-12-01)
Kanlayasiri, Kannachai
This research was aimed to study effects of indium (In) addition on solidus and liquidus temperatures, wetting time, wetting force, and microhardness of Sn-0.3Ag-0.7Cu lead-free solder alloy. It was found that In had a strong influence on these properties of Sn-0.3Ag-0.7Cu. Solidus and liquidus temperatures of the solder alloys was lowered as the In content was increased. However, In addition increased the melting range between solidus and liquidus temperatures. Wetting time of the solder alloy was reduced by the addition of In while the wetting force was increased with the increase of In content. Microhardness of Sn-0.3 Ag-0.7Cu was increased by adding In into the solder alloy. With the addition of In, the Sn-rich phase was smaller in size, and the intermetallic compounds were more uniformly distributed.
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Improving the performance of EDM deep hole using multi-hole interior flushing electrode
(2018-06-04)
Chuvaree, S.
;
Kanlayasiri, K.
In conventional flushing, when increasing the machining depth, the flushing ability becomes insufficient for ejection of the debris from machining gap. Debris concentration in the gap spark causes a process instability, low performance and high machining time etc. This paper proposes an innovative method of flushing technique for electrical discharge machining (EDM) of deep hole process. Tool electrode was specifically fabricated for flushing on the efficiency and stability of machining to promote the ejection of debris from machining gap. The performance of the deep hole process by electrical discharge machining under different flushing condition are presented. The results showed that the flushing through the tool electrode and multi-hole interior flushing are more preferred than side flushing. The result include 26.10% reduction in machining time (50 mm. in depth) when using multi-hole interior flushing electrode. In addition, the application of electrode multi-hole interior flushing electrode with electrode rotation improves the material removal rate (MRR) by 35.28% with 58.04% higher surface roughness (Ra).
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Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique
(2021-01-20)
Jongjinakool, Kavisra
;
Prakobsang, Tawipon
;
Plaipichit, Suwan
;
Kanlayasiri, Kannachai
;
Kitiwan, Mettaya
Since lead is a pollutant to the environment, therefore lead-free solder paste compounds have been interested in many research teams. The objective of this research is the investigation properties of solder paste with graphene oxide and reduced graphene oxide. In our experimental method the solder pastes of SnAgCu mixed with graphene oxide with bad electrical conductivity at different concentration by weight of 0.00%, 0.05%, 0.1% and 0.2% respectively. Subsequently, the shape changes of the compounds have been investigated by using digital in-line holography using laser diode wavelength 635 nm as the light source. The solder paste compounds were melted at 250 ± 5 °C and were recorded for every 5 seconds. Then, the contact angles of the melted solder paste compound have been determined using their digital holographic reconstructed images.
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Selection of electrode tips for the resistance spot welding of dissimilar stainless steels
(2018-08-14)
Khuenkaew, Teerawut
;
Kanlayasiri, Kannachai
This research sought to resolve the issue of electrode tip selection used in the resistance spot welding for two different stainless steel grades under otherwise identical welding parameters: SUS316 and SUS425. The study used a full fractional design in order to perform the analysis of the variables involved, while the quality of the weld was assessed by considering the indentation depth, penetration, and nugget diameter. The results of the study described the nugget diameter and penetration for all welds with the various different electrode tips which met the specified requirements of the customers. A single type of upper R30 and lower R30 electrodes achieved acceptable indentation depth. Ideally, good weld quality would demand a large nugget diameter, shallow indentation, and good penetration, all contribution to an acceptable overall appearance. Both R30 electrode tips are able to achieve the desired quality requirements in the spot welding process.

Kanlayasiri, Kannachai

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