Chuwattanakul, Varesa

Loading...
Thumbnail Image
Preferred name
Chuwattanakul, Varesa
Alternative Name
Chuwattanakul, V.
Main Affiliation
Email
varesa.ch@kmitl.ac.th

Settings

Now showing 1 - 2 of 2
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Publication,
    A comprehensive review on femtosecond laser polishing of silicon nitride: fundamentals, current progress, and industrial outlook
    (2026-01-01)
    Jian, Huang
    ;
    Pimsarn, Monsak
    ;
    Chuwattanakul, Varesa
    ;
    Eiamsa-ard, Smith
    Silicon nitride ((Formula presented.)) ceramics are indispensable in aerospace bearings and semiconductor substrates due to their exceptional mechanical and thermal properties. However, achieving damage-free, atomic-level surface finishes remains problematic. Traditional mechanical polishing induces subsurface microcracks, while chemical mechanical polishing (CMP) is plagued by low material removal rates and environmental toxicity. This review critically evaluates femtosecond laser polishing as a transformative, “green” non-contact alternative. We first elucidate the laser-matter interaction mechanisms specific to wide-bandgap (Formula presented.) ((Formula presented.) eV), clarifying how multiphoton absorption enables “cold ablation” by suppressing the heat-affected zone (HAZ) via the two-temperature model (TTM) dynamics. A distinct material removal mechanism driven by rapid thermal decomposition ((Formula presented.)) and phase explosion is highlighted. Synthesizing recent experimental data, we establish a quantitative process window. Operating slightly above the ablation threshold ((Formula presented.)) with high spot overlap (70%–90%) is critical to balance surface leveling against the incubation effect, which otherwise triggers porosity. Furthermore, we address the unique challenges of inducing periodic structures (LIPSS) on dielectric surfaces and propose a hybrid manufacturing strategy—integrating high-speed laser roughing with CMP finishing—to resolve efficiency constraints. Finally, an industrial roadmap involving high-throughput polygon scanners and AI-driven closed-loop control is outlined, providing a comprehensive reference for advancing femtosecond laser polishing toward scalable, high-precision manufacturing.
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Publication,
    Recent Advances in Welding Processes for High-Entropy Alloys: A Comprehensive Review
    (2026-01-01)
    Li, Min
    ;
    Pimsarn, Monsak
    ;
    Chuwattanakul, Varesa
    ;
    Eiamsa-Ard, Smith
    High-Entropy Alloys (HEAs) have gained attention for their exceptional mechanical properties, corrosion resistance, and unique microstructure. However, welding HEAs remains challenging, attributed to intricate microstructures, inadequate thermal conductivity, and elevated melting points. This review systematically summarizes recent advances in metal welding of HEAs with both similar and dissimilar alloys, including stainless steel, titanium alloys, aluminum alloys, and nickel-based alloys. Welding techniques, including Gas Metal Arc Welding (GMAW), Laser Welding (LW), Electron Beam Welding (EBW), and Gas Tungsten Arc Welding (GTAW) are critically compared in terms of joint microstructure, mechanical performance, and corrosion behavior. The influence of filler composition, heat treatment, and process parameters on weld quality are discussed. Key challenges, including microstructure evolution under complex service conditions and controlling brittle intermetallic phases, are identified. Finally, potential research directions and application prospects of HEA welding in advanced manufacturing are outlined.