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    A simplified and powerful image processing methods to separate Thai jasmine rice and sticky rice varieties
    (2018-01-01)
    Khondok, Piyoros
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    Suwansukho, Kajpanya
    A simplified and powerful image processing procedures to separate the paddy of KHAW DOK MALI 105 or Thai jasmine rice and the paddy of sticky rice RD6 varieties were proposed. The procedures consist of image thresholding, image chain coding and curve fitting using polynomial function. From the fitting, three parameters of each variety, perimeters, area, and eccentricity, were calculated. Finally, the overall parameters were determined by using principal component analysis. The result shown that these procedures can be significantly separate both varieties.
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    Enhanced hydrophilicity for TiO2 nanotube array by simultaneous nitrogen plasma and thermal annealing treatments
    (2018-09-05)
    Sattha, Chanawee
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    In this work, highly ordered TiO<inf>2</inf> nanotube (TNTs) array was fabricated by electrochemical anodization technique on titanium sheet. Simultaneous N<inf>2</inf> plasma and thermal annealing process were employed on TNTs using different N<inf>2</inf> gas flow rates at 500°C. As-anodized and N<inf>2</inf> plasma TNTs were characterized for their microstructure, surface elemental composition, and wettability by scanning electron microscope, X-ray diffraction, X-ray photoelectron spectroscopy (XPS), and contact angle measurement, respectively. It was found that N<inf>2</inf> plasma and thermal annealing treatments affect to the change of crystal structure, surface chemistry and wettability of TNTs. The N<inf>2</inf> plasma TNTs exhibits anatase phase with the orientations of (101) and (200). XPS spectra show that the nitrogen atom from plasma was introduced into the surface of TNTs and depends on the N<inf>2</inf> gas flow rates. From contact angle measurement, it can be observed the improvement of wettability (hydrophilicity) of the TNTs due to the N-doped TiO<inf>2</inf> nanotube after N<inf>2</inf> plasma and thermal annealing treatments.
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    Enhancing the electrical conductivity and thermoelectric figure of merit of the p-type delafossite CuAlO2 by Ag2O addition
    (2017-10-01)
    Pantian, Sarayut
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    (CuAlO<inf>2</inf>)<inf>1-x</inf>(Ag<inf>2</inf>O)<inf>x</inf> specimens with 0 ≤ x ≤ 0.06 were prepared through the sintering of mixtures of CuO, Al<inf>2</inf>O<inf>3</inf> and Ag<inf>2</inf>O powders at 1373 K. Hall effect, Seebeck coefficient and electrical conductivity measurements were subsequently employed to assess the electrical transport properties. The electrical conductivity of the as-sintered samples was found to increase with Ag<inf>2</inf>O addition as a result of increases in the carrier density. Over the temperature range of 323–623 K, the transport properties can be attributed to thermally activated transitions from the acceptor state to the valence band. In contrast, the variable range hopping theory is applicable over the temperature range of 623–873 K. Ag<inf>2</inf>O addition evidently reduces the defect binding energy in the electronic structure of the CuAlO<inf>2</inf>. The addition of this compound also obstructs the formation of both a spinel phase and CuO, such that the oxygen off-stoichiometry value and the carrier density are increased with increasing Ag<inf>2</inf>O levels. The presence of Ag metal has the main effect on thermal conductivity below 400 K, while above 400 K increases in the phonon concentration affect the conductivity. The highest value obtained for the figure of merit was 0.0044 at 573 K, from a sample containing 0.2 at.% Ag<inf>2</inf>O.
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    Optimum sintering temperature for thermoelectric properties of low-cost CuAl0.90Fe0.10O2 material
    (2016-10-01)
    Siriwongrungson, Vilailuck
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    Sintering temperature is a key parameter that affects thermoelectric properties. In this study, a suitable temperature to synthesize thermoelectric properties of low-cost delafossite CuAl<inf>0.90</inf>Fe<inf>0.10</inf>O<inf>2</inf> was investigated through the sintering of CuO, Al<inf>2</inf>O<inf>3</inf> and Fe<inf>2</inf>O<inf>3</inf> mixed powder at 1333, 1423 and 1473 K. The optimum sintering temperature is at 1333 K, where the single-phase CuAlO<inf>2</inf> and the highest dimensionless figure of merit of 0.014 at the measured temperature of 873 K were observed. CuAlO<inf>2</inf> with trace amounts of CuO, and CuAl<inf>2</inf>O<inf>4</inf> and CuO were found at the sintering temperature of 1423 and 1473 K, respectively. The highest Seebeck coefficient and thermal conductivity was at the sintering temperature of 1473 K, with the maximum electrical conductivity and power factor at the measured temperature of 873 K of 5.7 Ω<sup>−1</sup> cm<sup>−1</sup> and 9.81 × 10<sup>−5</sup> Wm<sup>−1</sup> K<sup>−2</sup>, respectively.
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    Figures of merit of low-cost CuAl0.9Fe0.1O2 thermoelectric material prepared at different solid state reaction sintering temperatures
    (2015-01-01) ;
    Thonglamul, Rungnapa
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    In this study, we investigated a CuAl<inf>0.9</inf>Fe<inf>0.1</inf>O<inf>2</inf> compound prepared at two different sintering temperatures in order to find out the effects of sintering temperature on the compound's figure of merit of thermoelectric properties. The thermoelectric CuAl<inf>0.9</inf>Fe<inf>0.1</inf>O<inf>2</inf> compounds were prepared from high purity grade Cu<inf>2</inf>O, Al<inf>2</inf>O<inf>3</inf> and Fe<inf>2</inf>O<inf>3</inf> powders. The mixture of these powders were ground and then pressed with uniaxial pressure into pellets. The pellets obtained were sintered in the air at 1423K and 1473K. X-ray diffraction (XRD) patterns showed a single phase of CuAl<inf>0.9</inf>Fe<inf>0.1</inf>O<inf>2</inf> with rhombohedral structure, R3¯m, along with a trace of CuO second phase. Moreover, the XRD peaks of the sample sintered at 1423K indicated that more Fe<sup>3+</sup> atoms replaced Al3+ atoms in this sample than they did in the sample sintered at 1473K. The average grain size of the CuAl<inf>0.9</inf>Fe<inf>0.1</inf>O<inf>2</inf> compound prepared increased with increasing sintering temperature, whereas its mean pore size and porosity decreased with increasing sintering temperature. The dispersed small pores markedly decreased the thermal conductivity of the compound, while the Fe<sup>3+</sup> substitution of Al<sup>3+</sup> increased its electrical conductivity. The highest figure of merit (ZT) found was 0.021 at 973K in the CuAl<inf>0.9</inf>Fe<inf>0.1</inf>O<inf>2</inf> sample sintered at 1423K. Our findings show that this low-cost material with a reasonable figure of merit is a good candidate for thermoelectric applications at high-temperature.
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    Achieving thermoelectric improvement through the addition of a small amount of graphene to CuAlO2 synthesized by solid-state reaction
    (2018-07-15)
    Daichakomphu, Noppanut
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    Harnwunggmoung, Adul
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    Pinitsoontorn, Supree
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    In this work, delafossite CuAlO<inf>2</inf> powders with graphene (0.00–0.20 wt%) were synthesized by a solid-state reaction method. X-ray diffraction and transmission electron microscope results indicated that graphene was segregated in CuAlO<inf>2</inf> as a split phase, such as composite material. A little addition of graphene content reduces the thermal conductivity and increases the carrier concentration because the graphene generates many point defects and aided carrier-phonon scattering. The CuAlO<inf>2</inf> with graphene content of 0.05 wt% shows the maximum electrical conductivity of 470 S/m at 700 K. In addition, the maximum value for ZT of 0.0045 was recorded at 575 K with the graphene/CuAlO<inf>2</inf> composite (0.05 wt%). Therefore, in brief, this study has highlighted the benefits of combining delafossite CuAlO<inf>2</inf> with a small amount of graphene as a potential route for achieving highly efficient thermoelectric materials.
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    Method of high active preparation and electrical properties of CuFeO2 delafossite-type
    (2014-01-01) ;
    Wichainchai, Aree
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    Hongaromkid, Yuttana
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    In this paper, the CuFeO<inf>2</inf> compound were prepared by classical solid state reaction (CSSR) and direct powder dissolved solution (DPDS) method from starting material metal oxides and metal powders. Preparation of two methods shows that, direct powder dissolved solution faster recover phases than classical solid state reaction method. The fastest method gets from starting materials Cu and Fe metal powders, the electrical conductivity, Seebeck coefficient, carrier concentration and mobility are 10. 68 S/cm, 244. 59 μV/K, 12. 86×10<sup>16</sup> cm<sup>-3</sup> and 494. 96 cm2/V. s, respectively. In addition, each CuFeO<inf>2</inf> compounds were investigated on crystal structure and electrical properties. From XRD and SEM results, all samples have a crystal structure delafossitetype (R3m) and a large grain boundary more than 15 μm by electrical conductivity corresponds to grain boundary and lattice parameter: a increases. Within this paper, from above results exhibit that preparation CuFeO<inf>2</inf> from Cu and Fe by direct powder dissolved solution method most appropriate for thermoelectric oxide materials due to high active for preparation else high lattice strain and high power factor are 0. 00052 and 0. 64×10<sup>-4</sup> W/mK<sup>2</sup>, respectively. © (2014) Trans Tech Publications, Switzerland.
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    Effect of real working environment/formation of oxide phase on thermoelectric properties of flexible Sb2Te3 films
    (2019-09-01) ;
    Harnwunggmoung, Adul
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    Flexible Sb<inf>2</inf>Te<inf>3</inf> thin films, for thermoelectric generator applications, were deposited by DC magnetron sputtering. As-deposited films were annealed in air to simulated a realistic operating environment. The oxidation behavior of the films was studied by monitoring their phase change on exposure to air at different temperatures between 50 and 300 °C for annealing times from 1 to 15 h. Oxidation of Sb and Te formed Sb<inf>2</inf>Te<inf>4</inf> and TeO<inf>2</inf> phases when annealing above 100 °C and Sb<inf>2</inf>Te<inf>3</inf> decomposed into oxide phases at an annealing temperature of 250 °C for 15 h. The thermoelectric performance decreased as the content of Sb<inf>2</inf>O<inf>4</inf> and TeO<inf>2</inf> phases increased. These findings show the limitations of Sb<inf>2</inf>Te<inf>3</inf> films operating in air without vacuum or a protective environment. We propose that the kinetic growth of oxide formation on the Sb<inf>2</inf>Te<inf>3</inf> thin films depend on chemical activation energy and oxygen diffusion through the oxide barrier by the variation of annealing temperature and annealing time, respectively.
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    Changes in structural, morphological, and corrosion properties of CrN thin film effected by varying N2 pressure In the sputtering process
    (2015-01-01)
    Wongtanasarasin, Wichuda
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    Suwansukho, Kajpanya
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    In this study, we investigate a facet of the fabrication process of chromium nitride (CrN) film intended as a protective coating for pineapple blades. CrN thin films were deposited on unpolished stainless steel substrates (AISI304) by DC reactive magnetron sputtering in Ar+N<inf>2</inf> gases. In principle, the proportion of nitrogen partial pressure to the total pressure in the sputtering process should have considerable effects on the CrN film's chemical composition, its crystal structure, its hardness, and its corrosion resistance. We tested this supposition out by using several different nitrogen partial pressures in the sputtering process and observed the films deposited. The coatings were deposited at five different nitrogen partial pressures of 4.0×10<sup>-4</sup> mbar, 8.0×10<sup>-4</sup> mbar, 1.2×10<sup>-3</sup> mbar, 1.6×10<sup>-3</sup> mbar, and 2.0×10<sup>-3</sup>. The deposition times were controlled to achieve 5-μm thick films in each deposition. The films were analyzed by several analytical methods, such as X-ray diffraction (XRD), scanning electron microscope, micro-hardness and potentiostat in pineapple juice. The XRD spectra of the films showed face-centered cubic structure with (200) preferred orientation, positively identifying them as Cr<inf>2</inf>N and CrN thin films. The calculated d-spacing and lattice parameter of the CrN films increased with increasing nitrogen partial pressure; the ranges were 0.283-0.287 nm and 0.491-0.497 nm, respectively. The cross-section morphology of the CrN films reveals the columnar grain growth with a high density. The crystal structure and the grain texture correspond with the hardness property. The films corrosion potential, an indicator of their corrosion property, was varied from -0.14 to -0.05 volts with varying nitrogen pressure. The most corrosion resistant and the good hardness were the film fabricated at the nitrogen partial pressure of 1.2×10<sup>-3</sup> mbar.
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    Empirical modelling and optimization of pre-heat temperature and Ar flow rate using response surface methodology for stoichiometric Sb2Te3 thin films prepared by RF magnetron sputtering
    (2017-01-01)
    Khumtong, Tanakorn
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    In this work, a flexible antimony telluride thin film was deposited by RF magnetron sputtering. The response surface methodology based on central composite design was used to study the influence of the Ar flow rate (A) and the pre-heat temperature of the substrate (T) on the Te content (%Te). The %Te of the thin film tended to increase with an increase in both the Ar flow rate and the pre-heat temperature. Stoichiometric Sb<inf>2</inf>Te<inf>3</inf> thin films were obtained that agreed with the model equation of %Te = 59.22 + 0.070 A - 0.098 T + 5.580 × 10<sup>−4</sup>AT – 7.212 × 10<sup>−4</sup>A<sup>2</sup> + 1.05 × 10<sup>−4</sup> T<sup>2</sup>. Micro-strainand dislocation density were enhanced using high Ar flow rate and low pre-heat temperature. The dislocation density and stoichiometry contributed to the substantially enhanced Seebeck coefficient and electrical conductivity of the films, respectively. The temperature dependence of the power factor is strongly dominated by electrical conductivity, leading to the highest value for a stoichiometric film of 2.0 × 0<sup>−3</sup> W/m.K<sup>2</sup> at 250 °C. During process optimization, several conditions can be prepared by RF magnetron sputtering with an Sb<inf>2</inf>Te<inf>3</inf> target in order to obtain stoichiometric Sb<inf>2</inf>Te<inf>3</inf> films. However, the expected condition to obtain highest power factor was the highest Ar gas flow rate and the lowest pre-heat temperature.