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Process-structure-property relationships in low-temperature microwave dielectric ceramics: from glass-assisted sintering to cold sintering for 5G/6G devices
Author(s)
Pulphol, Phieraya
Tang, Ying
Fang, Liang
Hajra, Sugato
Kim, Hoe Joon
Date Issued
December 1, 2026
Type
Review
Abstract
With the rapid advancement of wireless communication from 5G to 6G, a pressing need has emerged for microwave dielectric ceramics with excellent performance at reduced processing temperatures, compatible with low-temperature co-fired ceramic technology. This review traces historical milestones and highlights modern design strategies for achieving optimum dielectric constant, ultra-low dielectric loss, and near-zero temperature coefficient of resonant frequency. Special emphasis is placed on recent advances in low-temperature densification routes, including sintering aids, intrinsically low-sintering-temperature ceramic families, and novel techniques like the cold sintering process. This review provides a critical analysis of the performance trade-offs inherent to each strategy, addressing the persistent challenges in achieving ultra-low loss. Furthermore, we highlight the paradigm shift toward a holistic, multifunctional design imperative for 6G systems. Finally, the transformative potential of cross-disciplinary approaches, particularly AI-assisted discovery, and computational modeling, is discussed as a key enabler for accelerating the design of next-generation, high-performance, and sustainable LTCC-compatible materials.
Citation
Advanced Powder Materials, 5(6), 2026