Wetting state and mechanical property alteration for the Fe3Si films using rapid thermal annealing under various temperatures

Thumbnail Image

Date

2023-11-19

Authors

Journal Title

Journal ISSN

Volume Title

Publisher

Heliyon

Abstract

Si films.

Description

Keywords

Aluminum Alloys Composites Properties, Semiconductor materials and interfaces, Copper Interconnects and Reliability

Citation

URI

https://dspace.kmitl.ac.th/handle/123456789/17732

Collections

All

Endorsement

Review

Supplemented By

Referenced By