Kanlayasiri, Kannachai

Preferred name

Alternative Name

KANLAYASIRI, Kannachai

Kanlayasiri, K.

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School of Engineering

kannachai.ka@kmitl.ac.th

Now showing 1 - 10 of 44

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Optimizing the resistance spot-welding process for dissimilar stainless steels
(2018-06-04)
Khuenkaew, T.
;
Kanlayasiri, K.
The objective of this study was to identify the ideal welding circumstances to conduct resistance spot-welding in the case of 316 austenite and 425 ferrite stainless steels, which offer the challenge of being dissimilar. The study examines a number of welding variables, including weld current, weld time, hold time, electrode force, and the upper and lower electrode types. Initially, a 2<sup>6-1</sup> fractional factorial design was used for the screening of variables involved in the process. After this stage, the Box-Behnken design was employed for analysis of those variables and in order to specify the multiple response optimizations applicable to the size of nuggets through examination of the desirability function. The experiment was run using a resistance spot-welding machine at 50 kVA, 50 Hz. The quality of welded specimens was determined by their penetration, nugget diameter and nugget area. The optimal welding conditions were found to be 3.3 kN of electrode force, 25 cycles of weld time, 10,000 amperes of weld current, 50 cycles of hold time, and both R30 types of up-low electrodes. The optimal welding conditions provided nugget sizes of quality which were able to pass the specifications of the customer.
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Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead-Free Solder Paste
(2018-01-01)
Kanlayasiri, Kannachai
;
Meesathien, Nadee
This research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. The results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. The maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. The findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. The slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu<inf>6</inf>Sn<inf>5</inf> was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.
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EFFECT OF DIPPING SOLDERING ON THICKNESS AND INTERMETALLIC COMPOUND MORPHOLOGY BETWEEN Sn-3.0Cu LEAD-FREE SOLDER AND COPPER SUBSTRATE
(2022-01-01)
Mookam, Niwat
;
Kanlayasiri, Kannachai
The thickness and morphology of intermetallic compounds formed between Sn-3.0Cu lead-free solder and the copper substrate were investigated. In the experiment, the dipping soldering was performed at 350°C using Sn-3.0Cu lead-free solder for various dipping time lengths of 5, 10, 20, 50, 75 and 100s, respectively. The results indicated that η- Cu6Sn5 intermetallic phase was found to exist between the lead-free solder and the copper substrate. The formation of an ε-Cu3Sn particles on the η- Cu6Sn5 surface and grain boundary was found only when the substrate was soldered for 75 and 100s. The long soldering time and formation of ε-Cu3Sn particles resulted in the morphology of the η- Cu6Sn5 IMC changed from scallop shape to more round. Nevertheless, the thickness and morphology of intermetallic compounds was also found to be influenced by the diffusion controlled process.
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Improving the performance of EDM deep hole using multi-hole interior flushing electrode
(2018-06-04)
Chuvaree, S.
;
Kanlayasiri, K.
In conventional flushing, when increasing the machining depth, the flushing ability becomes insufficient for ejection of the debris from machining gap. Debris concentration in the gap spark causes a process instability, low performance and high machining time etc. This paper proposes an innovative method of flushing technique for electrical discharge machining (EDM) of deep hole process. Tool electrode was specifically fabricated for flushing on the efficiency and stability of machining to promote the ejection of debris from machining gap. The performance of the deep hole process by electrical discharge machining under different flushing condition are presented. The results showed that the flushing through the tool electrode and multi-hole interior flushing are more preferred than side flushing. The result include 26.10% reduction in machining time (50 mm. in depth) when using multi-hole interior flushing electrode. In addition, the application of electrode multi-hole interior flushing electrode with electrode rotation improves the material removal rate (MRR) by 35.28% with 58.04% higher surface roughness (Ra).
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Selection of electrode tips for the resistance spot welding of dissimilar stainless steels
(2018-08-14)
Khuenkaew, Teerawut
;
Kanlayasiri, Kannachai
This research sought to resolve the issue of electrode tip selection used in the resistance spot welding for two different stainless steel grades under otherwise identical welding parameters: SUS316 and SUS425. The study used a full fractional design in order to perform the analysis of the variables involved, while the quality of the weld was assessed by considering the indentation depth, penetration, and nugget diameter. The results of the study described the nugget diameter and penetration for all welds with the various different electrode tips which met the specified requirements of the customers. A single type of upper R30 and lower R30 electrodes achieved acceptable indentation depth. Ideally, good weld quality would demand a large nugget diameter, shallow indentation, and good penetration, all contribution to an acceptable overall appearance. Both R30 electrode tips are able to achieve the desired quality requirements in the spot welding process.
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Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
(2015-12-05)
Kanlayasiri, Kannachai
;
Ariga, Tadashi
The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0wt.%) were individually added into Sn58Bi and their respective microstructure, tensile strength, elongation, melting temperature, wettability and electrical resistivity of Sn58Bi-xNi were subsequently measured. The results indicated that Ni refined the microstructure of the solder matrix and induced the formation of Ni<inf>3</inf>Sn<inf>4</inf> intermetallic phase, and that the size and volume fraction of Ni<inf>3</inf>Sn<inf>4</inf> were positively correlated to the Ni content. The optimal concentration of Ni to enhance the tensile strength of the alloy was 0.1wt.%, but the elongation of the alloy was inversely correlated to the Ni content. The addition of Ni contributed positively to the melting temperature and wetting behavior of the alloy, whereas no significant change in the electrical resistivity of Sn58Bi-xNi was detected. In addition, Ni increased the thickness of the intermetallic layer at the interface, and only monoclinic η'-Cu<inf>6</inf>Sn<inf>5</inf> phase was present at the intermetallic layer. Nevertheless, the intermetallic phase of this research was dissimilar from the findings of existing literature.
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Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging
(2012-01-01)
Mookam, Niwat
;
Kanlayasiri, Kannachai
The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An η-Cu <inf>6</inf>Sn <inf>5</inf> intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a Cu <inf>3</inf>Sn intermetallic phase between the Cu <inf>6</inf>Sn <inf>5</inf> layer and the copper substrate. e{open}-Cu <inf>3</inf>Sn with an orthorhombic lattice structure was found together with hexagonal Cu <inf>3</inf>Sn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range. © 2012 The Chinese Society for Metals.
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Effects of brazing parameters on the microstructure and tensile shear force of copper sheets using amorphous filler metal
(2018-08-14)
Jattakul, Prajak
;
Kanlayasiri, Kannachai
In this research, the objective was to investigate and measure the microstructure, tensile shear force, and fracture surface behavior when copper sheets are brazed using Cu-Ni-Sn-P amorphous filler metal. In order to examine the microstructure and its properties, assessment of the Cu-Ni-Sn-P/copper brazed joints was conducted after furnace brazing under an argon atmosphere using specific parameters relating to temperature, holding time, and loading pressure. In order to assess the tensile shear force, tensile testing was carried out. All the joints exhibited sound bonding without voids or cracks, when brazing temperatures reached 680 °C, this resulted in a maximum value for tensile shear force of 696.325 N. The microstructure consisted of both Cu-rich solid solution and a (Cu, Ni)<inf>3</inf>P phase as a eutectic structure formed in the brazing joint, and then the Cu-rich solid solution was produced as a matrix region around the eutectic structure. Fracture analysis was conducted for brazed joints which showed the ductile fractures after the shear test.
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Influence of indium and zinc oxide nano-particles on properties of SAC0307-xIn-yZnO lead-free solder paste
(2016-02-17)
McCsathicn, Nadee
;
Makoto, Sawada
;
Ariga, Tadashi
;
Kanlayasiri, Kannachai
The influence of indium (In) and zinc oxide (ZnO) nano-particles on the properties of SAC0307-xIn-yZnO lead-free solder paste was presented in this paper. Solder paste was mixed with indium and zinc oxide nano-particles at various concentrations. The influence of these particles on melting point. wettability and interfacial layer after soldering with copper substrate was investigated. The results showed that the addition of lower levels of indium and zinc oxide nano-particles could reduce the melting temperature of SAC0307. Wettability of the solders on copper substrate in terms of contact angle was obviously decreased with the increase of appropriate indium and zinc oxide nano-particle concentration. The zinc oxide nano-particles affected the thickness value of the intermetallic layer. giving it a lower and more uniform distribution between the solder and copper substrate.
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Experimental Study on Failure Mechanism of Advanced High Strength Steels in Air Bending Process
(2018-06-04)
Pornputsiri, N.
;
Kanlayasiri, K.
This research investigated the failure phenomena and underlying damage mechanisms in small curvature bending and spring-back angles of two advanced high strength steel (AHSS) sheets (TRIP780 and DP980). The study also examined the effect of the bending angle on the failure mechanism. In the analysis, this research utilized an optimal microscope (OM), scanning electron microscope (SEM) and energy-dispersive X-ray spectroscope (EDX). The research findings indicated that the bending force and the bending angle were positively correlated and that the spring-back and bending angles were inversely correlated. On the failure mechanism, at the 45° bending angle, the initial crack was identified on the outer region of the LD-rolling DP980 sheet, while no visible crack emerged for the TD-rolling TRIP780 until arriving at the 60° bending angle, indicating that, by comparison, the former possessed the lowest bendability and the latter the highest.

Kanlayasiri, Kannachai

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