Process-structure-property relationships in low-temperature microwave dielectric ceramics: from glass-assisted sintering to cold sintering for 5G/6G devices

With the rapid advancement of wireless communication from 5G to 6G, a pressing need has emerged for microwave dielectric ceramics with excellent performance at reduced processing temperatures, compatible with low-temperature co-fired ceramic technology. This review traces historical milestones and highlights modern design strategies for achieving optimum dielectric constant, ultra-low dielectric loss, and near-zero temperature coefficient of resonant frequency. Special emphasis is placed on recent advances in low-temperature densification routes, including sintering aids, intrinsically low-sintering-temperature ceramic families, and novel techniques like the cold sintering process. This review provides a critical analysis of the performance trade-offs inherent to each strategy, addressing the persistent challenges in achieving ultra-low loss. Furthermore, we highlight the paradigm shift toward a holistic, multifunctional design imperative for 6G systems. Finally, the transformative potential of cross-disciplinary approaches, particularly AI-assisted discovery, and computational modeling, is discussed as a key enabler for accelerating the design of next-generation, high-performance, and sustainable LTCC-compatible materials.