Process-structure-property relationships in low-temperature microwave dielectric ceramics: from glass-assisted sintering to cold sintering for 5G/6G devices

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dc.contributor.authorPulphol, Phieraya
dc.contributor.authorTang, Ying
dc.contributor.authorFang, Liang
dc.contributor.authorVittayakorn, Wanwilai
dc.contributor.authorSukkha, Usa
dc.contributor.authorHajra, Sugato
dc.contributor.authorKim, Hoe Joon
dc.contributor.authorVittayakorn, Naratip
dc.contributor.authorMaluangnont, Tosapol
dc.date.accessioned2026-08-06T10:56:30Z
dc.date.available2026-08-06T10:56:30Z
dc.date.issued2026-12-01
dc.description.abstractWith the rapid advancement of wireless communication from 5G to 6G, a pressing need has emerged for microwave dielectric ceramics with excellent performance at reduced processing temperatures, compatible with low-temperature co-fired ceramic technology. This review traces historical milestones and highlights modern design strategies for achieving optimum dielectric constant, ultra-low dielectric loss, and near-zero temperature coefficient of resonant frequency. Special emphasis is placed on recent advances in low-temperature densification routes, including sintering aids, intrinsically low-sintering-temperature ceramic families, and novel techniques like the cold sintering process. This review provides a critical analysis of the performance trade-offs inherent to each strategy, addressing the persistent challenges in achieving ultra-low loss. Furthermore, we highlight the paradigm shift toward a holistic, multifunctional design imperative for 6G systems. Finally, the transformative potential of cross-disciplinary approaches, particularly AI-assisted discovery, and computational modeling, is discussed as a key enabler for accelerating the design of next-generation, high-performance, and sustainable LTCC-compatible materials.
dc.identifier.citationAdvanced Powder Materials, 5(6), 2026
dc.identifier.doi10.1016/j.apmate.2026.100444
dc.identifier.issn2772834X
dc.identifier.other2-s2.0-105043904580
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/18343
dc.sourceAdvanced Powder Materials
dc.subject5G/6G communication
dc.subjectCold sintering process (CSP)
dc.subjectLow dielectric loss
dc.subjectLow-temperature co-fired ceramic (LTCC)
dc.subjectMicrowave dielectric ceramic
dc.subjectSintering aid
dc.titleProcess-structure-property relationships in low-temperature microwave dielectric ceramics: from glass-assisted sintering to cold sintering for 5G/6G devices
dc.typeReview

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