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The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography
The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography
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Date
2015-07-29
Authors
T. Thong-on
T. Prakobsang
W. Pethsanthad
C. Boonsri
S. Plaipichit
P. Buranasiri
K. Yoshimori
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Digital holography
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https://dspace.kmitl.ac.th/handle/123456789/5264
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