The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography

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dc.contributor.authorT. Thong-on
dc.contributor.authorT. Prakobsang
dc.contributor.authorW. Pethsanthad
dc.contributor.authorC. Boonsri
dc.contributor.authorS. Plaipichit
dc.contributor.authorP. Buranasiri
dc.contributor.authorK. Yoshimori
dc.date.accessioned2025-07-21T05:56:04Z
dc.date.issued2015-07-29
dc.identifier.doi10.1117/12.2196277
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/5264
dc.subjectDigital holography
dc.subject.classificationDigital Holography and Microscopy
dc.titleThe investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography
dc.typeArticle

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