Kanlayasiri, Kannachai

Preferred name

Alternative Name

KANLAYASIRI, Kannachai

Kanlayasiri, K.

Main Affiliation

School of Engineering

kannachai.ka@kmitl.ac.th

Now showing 1 - 10 of 13

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Multi-Objective Optimization of Mn-Doped Tio2 Content for Wettability, Printability and Intermetallic Layer of Sac305 Pb-Free Solder Paste on a Cu Substrate
(2021-12-01)
Kanlayasiri, K.
;
Ariga, T.
Effects of Mn-doped TiO<inf>2</inf> nanoparticles on the wettability, printability and thickness of intermetallic layer of SAC30 on a Cu substrate were studied in this paper. Concentration of Mn-doped TiO<inf>2</inf> nanoparticles was varied from 0.05 wt.% to 1wt.%. The wettability was evaluated in terms of contact angle of solder on the copper substrate and the printability was measured from the volume ratio of printed solder on the copper substrate to volume of stencil opening. The experimental results showed that 0.10wt.% Mn-doped TiO<inf>2</inf> led to the lowest contact angle while the printability was decreased with the increase of the added nanoparticles and the thinnest intermetallic layer was found at 0.50wt.% Mn-doped TiO<inf>2</inf> nanoparticles. Mn-doped TiO<inf>2</inf> concentration was then optimized using a desirability function to find optimal values for the three responses. It was found that 0.07wt.% was the optimal concentration for the three metrics — wettability, printability and thickness of the intermetallic layer.
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Effect of bending temperatures on the microstructure and springback of a TRIP steel sheet
(2020-10-01)
Pornputsiri, Natthasak
;
Kanlayasiri, Kannachai
Transformation-induced plasticity (TRIP) steel possesses high strength and formability, enabling the use of a thinner gauge material and allowing for the fabrication of complex shapes. In this research, we measured the effect of bending temperatures on the microstructure and air-bending springback angle of TRIP steel at temperatures from 25 to 600 °C. Real-time in situ X-ray diffraction and scanning electron microscopy were used for pre- and postbending analysis. As the prebending temperature increased from 25 °C to 600 °C, the retained austenite (RA) volume fraction decreased, and the RA transformed to bainite at temperatures above 400 °C. The springback angle was positively correlated with the prebending RA volume fraction, with the smallest springback angle achieved at 400 °C. Additionally, the springback angle was positively correlated with the bending angle, because the RA transformation ratio contributed to increased strain hardening. Further microstructure analysis revealed that the RA became elongated in the tension direction as the bending temperatures increased.
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Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders
(2022-04-01)
KANLAYASIRI, Kannachai
;
MOOKAM, Niwat
The effect of Cu content on the microstructure, grain orientation and mechanical properties of Sn–xCu (x=0–4.0 wt.%) lead-free solder was studied. Results showed that added Cu induced the formation of intermetallic phases. Only the η-Cu<inf>6</inf>Sn<inf>5</inf> and ɛ-Cu<inf>3</inf>Sn phases were present in the β-Sn matrix. For all contents, the strongly preferred orientation of the β-Sn phase was formed on the {001} plane. In Sn doped with 1.0 wt.% Cu, the η-Cu<inf>6</inf>Sn<inf>5</inf> phase exhibited the preferred orientation of {0001} plane, whereas doping with 3.0 or 4.0 wt.% Cu transformed the preferred orientation to the {010} plane. In addition, only the {0001} and planes were present in the ɛ-Cu<inf>3</inf>Sn phase. The high Cu contents contributed to an increased number of low-angle boundaries, high residual strain, tensile strength and microhardness.
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Effects of side flushing and multi-aperture inner flushing on characteristics of electrical discharge machining macro deep holes
(2021-01-01)
Chuvaree, Suppawat
;
Kanlayasiri, Kannachai
This research investigates the effect of machining parameters on material removal rate, electrode wear ratio, and gap clearance of macro deep holes with a depth-to-diameter ratio over four. The experiments were carried out using electrical discharge machining with side flushing and multi-aperture flushing to improve the machining performance and surface integrity. The machining parameters were pulse on-time, pulse off-time, current, and electrode rotation. Response surface methodology and the desirability function were used to optimize the electrical discharge machining parameters. The results showed that pulse on-time, current, and electrode rotation were positively correlated with the material removal rate. The electrode wear ratio was inversely correlated with pulse on-time and electrode rotation but positively correlated with current. Gap clearance was positively correlated with pulse on-time but inversely correlated with pulse off-time, current, and electrode rotation. The optimal machining condition of electrical discharge machining with side flushing was 100 µs pulse on-time, 20 µs pulse off-time, 15 A current, and 70 rpm electrode rotation; and that of electrical discharge machining with multi-aperture flushing was 130 µs, 2 µs, 15 A, and 70 rpm. The novelty of this research lies in the use of multi-aperture flushing to improve the machining performance, enable a more uniform GC profile, and minimize the incidence of recast layer.
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Contact Angle Measurement of Melting SnAgCu Solder Paste Mix with Carbon Allotropes Using In-Line Digital Holography Technique
(2021-01-01)
Mamart, Wikatsama
;
Somdock, Nuttakrit
;
Boonsri, Chantira
;
Plaipichit, Suwan
;
Buranasiri, Prathan
In this research we investigated the contact angle of commercial SnAgCu solder paste mixing with some carbon allotropes such as graphite, graphene quantum dots, and fullerene of varying concentrations with melting temperature, wettability, interfacial microstructure. The wettability was assessed in terms of the contact angle. The in-line digital holography was used for determining the contact angle and morphological of samples at each temperature which the samples have been heating from room temperature until the melting temperature. In the experiment, only one beam was used as the object and reference beams which recorded by a CMOS camera. The recorded image was reconstructed by the angular spectrum digital holography numerical programing. Using the reconstructed images of our results, the shape and contact angle of solder pastes can be investigated.
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Influence of electrode shape and material on shear force and microstructure of resistance spot welded AZ80 magnesium alloy
(2025-01-05)
Sangrayub, Phoometh
;
Kanlayasiri, Kannachai
Resistance spot welding of AZ80 magnesium alloy is challenging owing to limited understanding of how electrode design and welding parameters interact to influence joint microstructure and strength. This study investigates the effects of electrode shape and material on the shear force and microstructure of resistance spot-welded AZ80 magnesium alloy. Three electrode shapes (A, R, and P) and two electrode materials (ZrCrCu and Al<inf>2</inf>O<inf>3</inf>Cu) were analyzed at welding currents of 13 kA and 17 kA. Nugget size and failure modes were also examined. The results demonstrate that electrode shape and material significantly affect welding heat, nugget size, and joint strength. The fusion zone (FZ) area increased due to the combined effects of welding current, electrode shape, and material. Higher welding heat modified the FZ boundary microstructure, transitioning from cellular morphologies to columnar dendrites, and eventually to equiaxed dendrites, thereby enhancing joint strength. The highest shear force was observed with an R-shaped ZrCrCu electrode at a welding current of 17 kA. However, excessive welding heat reduced the FZ area due to molten metal expulsion. It also promoted the growth of the brittle β-Mg<inf>17</inf>Al<inf>12</inf> phase in the coarse grain heat-affected zone (CGHAZ), shifting the fracture pattern from nugget pull-out to through-thickness in the base metal and decreasing joint strength. This study concludes that selecting appropriate electrodes can mitigate β-Mg<inf>17</inf>Al<inf>12</inf> phase growth in the CGHAZ, highlighting the importance of optimizing welding parameters for improved joint quality in AZ80 magnesium alloy welding.
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EFFECT OF DIPPING SOLDERING ON THICKNESS AND INTERMETALLIC COMPOUND MORPHOLOGY BETWEEN Sn-3.0Cu LEAD-FREE SOLDER AND COPPER SUBSTRATE
(2022-01-01)
Mookam, Niwat
;
Kanlayasiri, Kannachai
The thickness and morphology of intermetallic compounds formed between Sn-3.0Cu lead-free solder and the copper substrate were investigated. In the experiment, the dipping soldering was performed at 350°C using Sn-3.0Cu lead-free solder for various dipping time lengths of 5, 10, 20, 50, 75 and 100s, respectively. The results indicated that η- Cu6Sn5 intermetallic phase was found to exist between the lead-free solder and the copper substrate. The formation of an ε-Cu3Sn particles on the η- Cu6Sn5 surface and grain boundary was found only when the substrate was soldered for 75 and 100s. The long soldering time and formation of ε-Cu3Sn particles resulted in the morphology of the η- Cu6Sn5 IMC changed from scallop shape to more round. Nevertheless, the thickness and morphology of intermetallic compounds was also found to be influenced by the diffusion controlled process.
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A New Technique for Brazing Porous Copper to Copper Substrate Using CuNiSnP Amorphous Filler Metal
(2025-11-01)
Mookam, Niwat
;
Jattakul, Prajak
;
Ariga, Tadashi
;
Kanlayasiri, Kannachai
Furnace brazing is a common method for bonding porous metal to a substrate. However, it typically involves lengthy brazing times. This research introduces a novel rapid brazing technique to join porous copper to copper substrates. Using CuNiSnP amorphous filler metal, porous copper specimens were brazed under varying currents (250-1000 A) and times (900-1100 ms). Results showed successful joining without macroscopic deformation of the porous copper, and the brazing times were significantly shorter than those of traditional methods. Microstructural analysis revealed primary alpha, primary beta, and eutectic structures in the joint, all of which were influenced by brazing current and time. Adjusting the brazing conditions altered the morphology of the primary alpha structure, ranging from equiaxed to columnar dendrites, which in turn affected the joint's mechanical properties. The proposed technique offers an efficient method to manipulate joint microstructures for bonding porous copper to copper substrates, potentially improving manufacturing efficiency in industries such as heat exchangers or catalytic converters.
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Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique
(2021-01-20)
Jongjinakool, Kavisra
;
Prakobsang, Tawipon
;
Plaipichit, Suwan
;
Kanlayasiri, Kannachai
;
Kitiwan, Mettaya
Since lead is a pollutant to the environment, therefore lead-free solder paste compounds have been interested in many research teams. The objective of this research is the investigation properties of solder paste with graphene oxide and reduced graphene oxide. In our experimental method the solder pastes of SnAgCu mixed with graphene oxide with bad electrical conductivity at different concentration by weight of 0.00%, 0.05%, 0.1% and 0.2% respectively. Subsequently, the shape changes of the compounds have been investigated by using digital in-line holography using laser diode wavelength 635 nm as the light source. The solder paste compounds were melted at 250 ± 5 °C and were recorded for every 5 seconds. Then, the contact angles of the melted solder paste compound have been determined using their digital holographic reconstructed images.
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A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages
(2020-10-01)
Kyaw, Tin Tin
;
Tunthawiroon, Phacharaphon
;
Kanlayasiri, Kannachai
;
Yamanaka, Kenta
;
Chiba, Akihiko
The wettability and formation of intermetallic compounds (IMCs) formed between a Co–Cr–Mo-based alloy and Sn-solder metal were investigated using the reflow soldering method. Soldering was conducted in an electric furnace in separate experiments at temperatures of 533, 553, 573, 623, and 673 K for 600 s. The morphology of the intermetallic layer formed at the Co–Cr–Mo-based/Sn-solder interface was characterized by scanning electron microscopy (SEM). The chemical composition and phase of the formed intermetallic layer were analyzed by electron probe microscopic analysis (EPMA) and X-ray diffraction analysis. Wettability analysis indicated that the soldering temperature influenced the wettability. With increasing soldering temperatures, the spreading factor increased, whereas the contact angle decreased. The intermetallic layers were found in triples in the intermediate zone between the solidified Sn-solder and the Co–Cr–Mo-based substrate. The thickness of the intermetallic layers increased in proportion with increasing soldering temperature. The EPMA analysis indicated only two IMCs formed at the interface of the joint at all of the investigated soldering temperatures, although three interfacial layers were observed by SEM analysis. The Sn-richer phase, Co(Cr,Mo)Sn<inf>2</inf>, formed adjacent to the Sn-solder matrix, whereas the Co(Cr,Mo)Sn was found near the Co–Cr–Mo-based substrate. The nanoindentation measurement revealed that the formed Co(Cr,Mo)Sn<inf>2</inf> and Co(Cr,Mo)Sn IMCs possessed lower hardness values compared to the Sn–Cu intermetallic systems.

Kanlayasiri, Kannachai

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