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    Carrier lifetime of platinum doped P-N diode after irradiation by soft X-ray
    (2013-08-30)
    Nararug, Budsara
    ;
    Srithanachai, Itsara
    ;
    Ueamanapong, Surada
    ;
    Khunkhao, Sanya
    ;
    Janprapha, Supakorn
    This paper analyzes the effect of X-ray irradiation on the electrical properties of Pt-doped p-n diode. X-ray energy irradiated on Pt-doped P-N diode with 70 keV with time 205 sec. After irradiations, the current-voltage (I-V) characteristics and capacitance-voltage (C-V) characteristics and carrier degeneration lifetime (τ<inf>g</inf>) were investigated. The results show that the leakage current is slightly increased after the diodes were exposed X-ray and affect higher degeneration carrier lifetime. The effects after X-ray irradiation indicated that the defects of the diode have been changed. © (2013) Trans Tech Publications Switzerland.
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    Porous Silicon Formation by Stain Etching on Pyramid Surface in U-Shape MSM Photodetector
    (2024-01-01) ; ;
    Vijafun, Jidapa
    ;
    Suttijalern, Kamonwan
    ;
    Niemcharoen, Surasak
    In this paper, the porous silicon formation on pyramid surface in U-shape MSM photodetector was studied. Stain etching technique was used to prepare porous silicon material. The solution for stain etching contained the mixed solution of hydrofluoric acid (HF), nitric acid (HNO<inf>3</inf>) and deionized water (DI) with ratios 1: 3: 5 and used halogen lamp expouse 30,000 lux between etching for excite porous formation in 2 minutes. Porous silicon was fabricated on pyramid surface in U shape which between metal electrode titanium and aluminum on p-type silicon 20-25 Ω-cm to reduce the reflection of incident light and to increase a photocurrent of MSM photodetector. In the final part of this paper are the comparison physical morhhology and electrical characteristic of porous silicon on pyramid surface in U shape MSM photodetector with pyramid in U-shape MSM photodetector without porous silicon on the surface and planar MSM photodetector. The physical morphology of porous silicon on pyramid surface in U-shape was studied by using scanning electron microscopy (SEM). The electrical characteristic was investigated by using incident light with wave length 635 nm and power 6 mW at bias voltage 10 V. The result of comparison, we found that porous silicon on the surface of pyramid in U-shape MSM photodetector is rougher than pyramid in U-shape MSM photodetector without porous silicon on the surface. The electrical characteristic of porous silicon on pyramid surface in U-shape MSM photodetector respond incident light higher than pyramid in U-shape MSM photodetector without porous silicon on the surface. Therefore the forming porous silicon on the suface of pyramid in U-shape MSM photodetector is appropriate for the fabrication of MSM photodetector with high photocurrent.
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    Defects study by activation energy profile for lowering leakage current in p-n junction
    (2011-01-01)
    Srithanachai, Itsara
    ;
    Ueamanapong, Surada
    ;
    Rujanapich, Poopol
    ;
    ;
    Niemcharoen, Surasak
    Diode leakage current consists of diffusion (I<inf>d</inf>) and generation current (I<inf>g</inf>), which is strongly sensitive to the residual defect density. These defects can be studied by activation energy (E<inf>a</inf>). Therefore, this paper presents a method for calculating activation energy of silicon p-n junctions from volume generation current. It combines temperature-dependent current-voltage (I -V) and capacitance- voltage (C-V) measurements of diodes. The I<inf>g</inf> can be found from the volume leakage current by subtraction of the volume diffusion current, which is calculated while the depletion width is zero. The activation energy (E<inf>a</inf>) is derived from slope of an Arrhenius plot of I<inf>g</inf>. To derive the correct slope the temperature dependence of the depletion width, which is obtained from the corrected volume capacitance has been applied. The E<inf>a</inf> profile below junction has been shown. The lower E<inf>a</inf> value has been found near the junction, which may relate to the junction implantation. © (2011) Trans Tech Publications.
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    Alcohol vapor detection by using nanoporous silicon as based sensor
    (2013-01-01) ;
    Niemcharoen, Surasak
    In this paper, we are concerned with fabrication of alcohol vapor sensor based on nanoporous silicon. In order to use nanoporous silicon as alcohol vapor sensor, we made nanoporous silicon onto p-type silicon wafer by electrochemical etching of silicon wafer in hydrofluoric acid solution. The structure of this sensor consists of nanoporous silicon layer and aluminum electrode which is deposited on the top of nanoporous silicon layer by evaporator. In this research, we are concerned the variation of electrical properties of this sensor due to presence of different concentration of alcohol vapor. From the experiment, it is found that this sensor can detect the different concentrations of alcohol vapor in the rang 1000 ppm to 250 ppm.
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    Extraction of mobility degradation, effective channel length and total series resistance of NMOS at elevated temperature
    (2011-08-12)
    Kiddee, Kunagone
    ;
    Ruangphanit, Anucha
    ;
    Niemcharoen, Surasak
    ;
    ;
    This article describes the extraction of total series resistance, effective channel length and low field effective channel mobility degradation parameter at temperature in the range of 25°C-125°C of NMOS device. The relation of I<inf>DS</inf> and V<inf>GS</inf> in a linear region was used with a different of channel length. The procedure is based on the measurement of the transconductance characteristics of MOSFET in the linear region. The transconductance characteristics is determine for the several devices of difference drawn channel length. The results shows that, the effective channel length is increased in a range of 5×10<sup>-10</sup> m/°C. The low field mobility degradation parameter is decreased by the factor of 0.733. The total series resistance is increased in the range of 1.4 Ω-μm/°C. The errors between the predicted model and measured of I<inf>DS</inf>&V <inf>GS</inf> in linear region is approximately 3%. © 2011 IEEE.
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    Fabrication, characterization and analysis of ITO/n-Si Schottky photodetector
    (2010-07-30)
    Ueamanapong, Surada
    ;
    Srithanachai, Itsara
    ;
    ;
    Pengpad, Putapon
    ;
    Niemcharoen, Surasak
    In this article, we have studied contact between indium tin oxide (ITO) and n-type silicon. First, the characteristics of ITO thin films have been identified. The films have high transparent and low resistivity (∼88 % of transmittance and 2.8×10<sup>-3</sup> Ω-cm). Fabrication of the ITO/n-Si photodetector was presented which was ITO thin layer deposited on 10 Ω-cm resistivity silicon wafer by R.F. sputter method. Finally, a study of characteristics of the photodetector such as I-V characteristics, C-V characteristics, and frequency response has been done. The photodetectors have built in voltage (V<inf>bi</inf>) about 0.26 V, the dark current of 5 μA and light current of 1.5 mA at 25,000 lux, 5V. Capacitance and frequency response are about 110 pF and 120 kHz, respectively.
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    Photocurrent enhancement between two coplanar schottky-barriers on silicon MSM photodetector
    (2013-06-03) ;
    Niemcharoen, Surasak
    Gain properties of dc and ac photocurrent generated between two Schottky barriers coplanarly placed on silicon metal-semiconductor-metal photodetector have been investigated experimentally. The test structure has two square Mo/n-Si Schottky barrier junctions on an n-type silicon substrate with a resistivity of 9-12 Ω-cm and the junction internal separation is 20μm. The current-voltage (I-V) characteristics under illumination in visible range showed a rapid increase in the photocurrent at higher bias region. From the I-V characteristics and noise measurements, increase in photocurrent was ascribed to avalanche multiplication of carriers photogenerated in the reverse-biased Schottky junction. From observation of optical signal demodulation at low frequencies (10 kHz and 50 kHz), it was found that multiplication factor larger than 100 at 10 kHz and 30 at 50 kHz was achieved respectively. © (2013) Trans Tech Publications, Switzerland.
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    Application of nanoporous silicon for a metal-semiconductor-metal visible light photodetector
    (2011-01-01) ;
    Niemcharoen, Surasak
    ;
    Titiroongruang, Wisut
    In this paper we present a study on the application of nanoporous silicon to an optoelectronic device called a nanoporous silicon metal-semiconductor- metal (MSM) visible light photodetector. This device was fabricated on a nanoporous silicon layer which was formed by electrochemical etching of a silicon wafer in a hydrofluoric acid solution under various anodization conditions such as the resistivity of the silicon wafer, current density, concentration of the hydrofluoric acid solution and anodization time. The structure of this device has two square Al/nanoporous silicon Schottkybarrier junctions on the silicon substrate and the electrode spacing is 500 μm. The experiment will study photoresponse and the response time of a nanoporous silicon MSM photodetector which was fabricated on the various porosity of a nanoporous silicon layer. It is found that when devices are fabricated on a higher porosity nanoporous silicon layer, the photoresponse of the device will expand toward the short-wavelength and the bandwidth of the spectrum response will cover visible light. In addition, it is found that the response time of the device decreases. Copyright © 2011 American Scientific Publishers All rights reserved.